GB 51291-2018
共烧陶瓷混合电路基板厂设计标准
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Scope as published
本标准适用于采用低温共烧陶瓷(LTCC)和高温共烧陶瓷(HTCC)工艺制造的混合电路多层互连基板生产厂新建、扩建和技术改造工程。
The original Chinese text is authoritative; this excerpt is retained as catalogue metadata, not a translated normative requirement.
Version history
Earlier editions: None recorded
Later editions: None recorded
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